-
1 mask step
1) маскування2) сходинка на масціEnglish-Ukrainian dictionary of microelectronics > mask step
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2 mask
1. ім.1) фотошаблон; шаблон; (вільна) маска; трафарет2) маска, маскуючий шар2. дієсл. маскувати - artwork mask
- base-region mask
- base mask
- base-resistor mask
- bimetal mask
- blocking mask
- chrome mask
- collector mask
- composite mask
- contact-area mask
- contact mask
- contact-print additional mask
- custom mask
- deep UV mask
- delineation mask
- deposition mask
- diffusion mask
- doping mask
- dry film solder mask
- E-beam mask
- E-chrome mask
- electron-beam generated mask
- emitter mask
- emulsion mask
- etch ing mask
- etch mask
- etch-resistantmask
- etch-resistmask
- evaporation mask
- exposure mask
- fault injection mask
- faultless mask
- field-oxidemask
- fieldmask
- fine-line mask
- gold mask
- grid mask
- hard-surface mask
- high-contrast X-ray mask
- high-flatness mask
- high-transmission X-ray mask
- IC mask
- in situ mask
- insulator mask
- interconnection mask
- ion-beam stencil mask
- ion-implantation mask
- iron-oxide mask
- isolation mask
- layered mask
- lithographic mask
- master mask
- metal mask
- metal etched mask
- metallization etching mask
- metal-on-glass mask
- metal-on-polymer mask
- moving mask
- multi-pinhole mask
- native охide mask
- negative mask
- nonerodible mask
- offset mask
- optical mask
- optical gate mask
- overlaid mask
- oxidation mask
- oxygen-impermeable mask
- pattern mask
- pattern transfer mask
- photolithographic mask
- photoresist mask
- plating mask
- production mask
- programmingmask
- programmask
- projection mask
- p-well mask
- quartz mask
- refractory mask
- resistor-body mask
- reticle mask
- self-aligned mask
- sputter mask
- stencil mask
- step-and-repeat mask
- thick-film screen mask
- thin-film mask
- trench mask
- vacuum-deposition mask
- work mask
- X-ray lithography mask
- X-ray mask
- 1x mask
- 1:1 mask -
3 step
1. ім. 1) (технологічна) операція 2) сходинка, ступінь 3) крок (напр. мультиплікація) 2. дієсл. послідовно експонувати з кроковим переміщенням; послідовно мультиплікувати з кроковим переміщенням - execute step
- interconnection step
- mask step
- mesa step
- oxide step
- pattern-printing step
- photolithographic step
- photomasking step
- predeposit step
- processing step
- process step
- yellow room’s step -
4 step-and-repeat mask
фотошаблон, виготовлений фотоповторювачемEnglish-Ukrainian dictionary of microelectronics > step-and-repeat mask
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5 aligner
установка суміщення (і експонування); установка літографії- automaskaligner- autoaligner
- contact aligner
- deep-UV projection aligner
- diffusion tube aligner
- direct step-onto-wafer aligner
- electron-beam aligner
- full-field mask aligner
- full-field aligner
- hard-contact aligner
- mask aligner
- projection aligner
- proximity aligner
- reduction projection aligner
- site aligner
- soft-contact aligner
- step-and-repeat aligner
- step-by-step aligner
- stepper aligner
- shadow projection mask aligner
- shadow mask aligner
- submicron mask aligner
- submicron aligner
- wafer aligner
- wafer-stepping aligner
- X-ray aligner -
6 system
1) система 2) устаткування; пристрій - assembly system
- autolayout system
- automated accounting system
- automated photomasking system
- automated photomask system
- automatic data асquisition system
- automatic data analysis system
- automatic data digitizing system
- base-metal system
- batch system
- bi-etching system
- bubble test system
- building-block layout system
- CAD system
- cassette-to-cassette system
- chopping system
- closed-tube oxidation-diffusion system
- code-translation data system
- command retrieval system
- computer-aided design system
- conductor paste system
- conductor system
- continuous stage motion e-beam system
- Czochralski production system
- damage tolerant system
- data асquisition and display system
- data analysis and reduction system
- data collection and processing system
- decision data support system
- decision-support system
- deep-UV projection system
- design automation system
- die attach system
- dielectric paste system
- dielectric system
- diffusion system
- direct step-on-wafer system
- direct-write e-beam system
- dopant system
- double-chamber vacuum-deposition system
- double-track system
- electron-beam mask system
- electron-beam projection system
- encapsulation welding system
- epitaxial growth system
- epitaxial system
- epoxy dispensing system
- etchant regeneration system
- etching system
- etch/strip system
- evaporation system
- exposure system
- fabrication system
- fault-tolerant system
- flex-fab system
- flexible machining system
- fly’s eye system
- gate-array layout system
- Gaussian-beam e-beam system
- Genesil system
- graphite furnace atomic absorption system
- hierarchically CAD system
- hierarchical-oriented CAD system
- high-resolution electron-beam system
- IC system
- image projection system
- indexing system
- ink system
- in-line system
- integrated programmable gate-array system
- ion-beam system
- ion-beam sputtering system
- isoplanar system
- laminar-flow system
- lead-forming system
- lead-frame assembly system
- lithographic system
- lithography system
- logic analysis system
- logic synthesis system
- mask alignment and exposure system
- metal system
- metallization system
- Micralign system
- micro-Optical Electro-Mechanical systems MOEMS
- micro-Optical Electro-Mechanical systems
- micropower system
- multichip system
- multicircuit microprocessor system
- multidomain system
- multiple-tens camera system
- negative-resist system
- non-real-time data automation system
- one-step t-fault diagnosable system
- one-to-one scanning system
- on-line circuit analysis system
- on-line circuit design system
- open-ended CAD system
- open-tube system
- palladium-silver thick-film conductor system
- palladium-silver conductor system
- paste system
- photomasking system
- photorepeating system
- pick-and-place system
- planar plasma system
- plenum flush system
- portable CAD system
- positive resist system
- preinsertion processing system
- printed-circuit board assembly system
- printed-circuit assembly system
- probing system
- processing system
- production system
- projection printing system
- projection system
- quick vacuum system
- reduced system
- reducing electron -beam projection system
- reducing electron projection system
- reflow soldering system
- rinser/dryer system
- screen printing system
- scribing system
- self-documenting CAD system
- self-repair system
- sequentially t-fault diagnosable system
- shaped-beam e-beam system
- single-chip system
- SMIF system
- software test-bed system
- solder evacuation system
- solder fusion system
- split-chamber vacuum coating system
- split-field alignment system
- step-and-repeat system
- step-and-repeat photomask system
- step-on-wafer projection system
- surface measurement system
- terminal point detection system
- thermal mapping system
- thick-film resistor system
- transfer system
- transport system
- tri-metal system
- trimming system
- turnkey CAD system
- UV exposure system
- vacuum-deposition system
- vacuum purge system
- variable-shaped electron-beam exposure system
- vector-scan e-beam system
- wafer gaging system
- wafer routing system
- wafer-scale system
- wafer-stepper projection system
- wave solder system
- wiring system
- X-ray exposure system -
7 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
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8 pattern
1. ім.1) малюнок; зображення; образ; рельєф2) конфігурація, форма2. дієсл. формувати малюнок; формувати зображення; формувати рельєф; структурувати - chip pattern
- circuit pattern
- computer-generated pattern
- conductive pattern
- conductor pattern
- contact pattern
- contiguous-disk propagation pattern
- customized metallization pattern
- discretionary wiring pattern
- dislocation pattern
- domain pattern
- dopant pattern
- electron-beam pattern
- electron diffraction pattern
- emitter pattern
- error-free layout pattern
- etchedpattern
- etchpattern
- fine-line pattern
- fine-linewidth pattern
- fixed-interconnection pattern
- gate pattern
- geometric pattern
- growth pattern
- high-aspect ratio pattern
- insulation pattern
- integrated-circuit pattern
- interconnection mask pattern
- layout pattern
- lead pattern
- mask pattern
- masked реrmalloy pattern
- masking pattern
- master pattern
- measurement pattern
- metal-finger pattern
- multiple pattern
- optical pattern
- oxide pattern
- permalloy propagation pattern
- photographic emulsion-maskpattern
- photographic emulsionpattern
- photoresist film pattern
- photoresist pattern
- photoresist mask pattern
- process evaluation and control pattern
- programmed-interconnection pattern
- regular pattern
- repetitive pattern
- reticle pattern
- routing pattern
- shifting test pattern
- silicon pattern
- step coverage pattern
- striation pattern
- subisolation pattern
- sunken охide pattern
- surface relief pattern
- test pattern
- thick-film pattern
- thin-film pattern
- transistor pattern
- wafer pattern
- wiring pattern -
9 equipment
устаткування; апаратура - assembly equipment
- automated test equipment
- automatic drafting equipment
- beam-tape microinterconnection equipment
- capital equipment
- chip production equipment
- computer-aided equipment
- computer update equipment
- cryogenic equipment
- diffusion equipment
- direct-wafer-stepping equipment
- evacuation equipment
- fabrication equipment
- high-vacuum technology equipment
- in-line equipment
- inspection equipment
- interactive graphics equipment
- interconnection equipment
- leased-circuit connection equipment
- manufacturing equipment
- masking equipment
- mask-making equipment
- microinterconnection equipment
- photolithography equipment
- plotting equipment
- polysilicon diffusion equipment
- printing equipment
- processing equipment
- production equipment
- projection alignment equipment
- step-and-repeat equipment
- step-on-wafer equipment
- support equipment
- tape-carrier system equipment
- wafer handling equipment
- wafer-measuring equipment
- wafer-processing equipment
- wafer-stepping equipment
- yellow room equipmentEnglish-Ukrainian dictionary of microelectronics > equipment
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10 lithography
(мікро) літографія. Процес перенесення малюнка на поверхню пластини за допомогою світлового випромінювання (photolithography), потоку електронів або рентгенівського випромінювання (X-ray lithography) - charged-particle lithography
- contact lithography
- contactless lithography
- contrast-enhanced lithography
- deep-UV lithography
- direct growth lithography
- direct-write electron-beam lithography
- dot lithography
- dual-surface lithography
- electron-beam lithography
- electron lithography
- excimer laser lithography
- fine-line lithography
- focused ion-beam lithography
- full-wafer lithography
- bard-contact lithography
- high-resolution lithography
- high-voltage EB lithography
- holographic lithography
- hybrid lithography
- i-line lithography
- ion-beam lithography
- laser-basedlithography
- laserlithography
- lift-off lithography
- mask lithography
- maskless lithography
- micrometer micron lithography
- micron lithography
- molecular-level lithography
- optical lithography
- positive-resist projection lithography
- precise registration lithography
- projection lithography
- proximity lithography
- raster-scan electron-beam lithography
- resistless lithography
- scaled-down lithography
- scanning electron-beam lithography
- scanning ion-beam lithography
- self-aligned dual-surface lithography
- soft lithography
- soft-contact lithography
- step-and-repeat lithography
- step-on-wafer lithography
- stepper lithography
- submicron lithography
- synchrotron-radiationlithography
- synchrotronlithography
- ultraviolet lithography
- vector-scan electron-beam lithography
- wafer lithography
- wafer-stepper lithography
- write e-beam lithography
- X-ray lithographyEnglish-Ukrainian dictionary of microelectronics > lithography
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11 method
метод (див. т-ж approach, technique) - method of short circuits time constants
- aligning method
- angle-lappingmethod
- angle-lapmethod
- batch method
- Bridgeman-Stockbarger method
- computerized reliability analysis method
- critical path method
- crucibleless method
- CZ Czochralski method
- CZ method
- directional etch method
- double-crucible method
- edge-based method
- epitaxial isolation method
- event-driven method
- Euler’s method
- fault driven method
- finite-difference method
- finite-element method
- flip-chip method
- floating -zone method
- float -zone method
- four-point probe method
- four probe method
- greedy method
- Green function method
- hand-drafted method
- horizontal Bridgeman method
- LEC liquid encapsulated Czochralski method
- LEC method
- low-pressure triode method
- manufacturing method
- masking method
- MCmethod
- method modified nodal analysis method
- Monte-Carlo method
- noncontact method
- over-under probe method
- photolithography method
- photomasking method
- scan direct access method
- scan-path method
- screening method
- self-aligning method
- silicon compiler method
- single-mask method
- standard-сеll method
- standing-wave method
- state variable method
- step-and-repeat multilens method
- step-and-repeat multiple-pinhole method
- symbolic layout method
- weak beam method
- wire method
- wire-wrap method -
12 carrier
1) носій (заряду) 2) носій; утримувач 3) касета 4) кремнієва підкладка; керамічна підкладка; друкована плата - ceramic carrier
- charge carrier
- chip carrier
- conductive carrier
- current carrier
- diffusion -step carrier
- diffusion carrier
- extrinsic carrier
- flip-chip carrier
- furnace slice carrier
- furnace carrier
- hybrid carrier
- inert carrier
- injected carrier
- intrinsic carrier
- leaded chip carrier
- leadless chip carrier
- majority carrier
- mask carrier
- microcircuit carrier
- minor carrier
- minority carrier
- multichip carrier
- multilayer chip carrier
- photogenerated charge carrier
- polyimide carrier
- post molded chip carrier
- premolded chip carrier
- ring carrier
- single-layer chip carrier
- substrate carrier
- tape chip carrier
- wafer carrier -
13 exposure
1) експонування 2) розкриття, оголення (напр. шару під маскою) - contact exposure
- deep-UV exposure
- die-by-die pattern exposure
- direct wafer exposure
- direct-writing exposure
- electron-beam exposure
- flood exposure
- full-field [full-wafer] exposure
- ion exposure
- laser exposure
- light optical exposure
- light exposure
- mask exposure
- multiple exposure
- pattern exposure
- postdevclopment exposure
- projection exposure
- proton exposure
- proximity exposure
- SOR exposure
- step-and-repeat exposure
- synchrotron exposure
- ultraviolet exposure
- X-ray exposure -
14 preparation
- computer-aided preparation
- die preparation
- mask preparation
- single-step preparation
- substrate preparationEnglish-Ukrainian dictionary of microelectronics > preparation
-
15 printing
1) трафаретний друк, сіткографія 2) літографія; фотолітографія (див. т-ж lithography, photolithography) - direct printing
- metal screen printing
- reduced mask printing
- shadow printing
- step printing
- thick-film printing -
16 process
1. ім.1) процес; (технологічний) метод, спосіб2) технологія (див. т-ж technique, technology)3) (технологічна) обробка; технологічна операція2. дієсл. обробляти; проводити технологічну операцію - all-ion-implant process
- all-planar process
- Auger process
- batch process
- BH bias and hardness process
- BH process
- bonding process
- BOX process
- bulk CMOS process
- bumping process
- chip-on-board process
- closed CMOS process
- CMOS-on-sapphire process
- composite сеll logic process
- contact process
- conventional process
- deep охide isolation process
- DIFET process
- diffused eutectic aluminum process
- direct synthesis and crystal pull process
- double-diffused process
- double ion-implanted process
- double-layer polysilicon gate MOS process
- double-layer polysilicon gate process
- epitaxial deposition process
- epitaxial process
- epitaxial growth process
- flip-over process
- floating-gate silicon process
- front-end process
- gold-doped process
- guard-banded CMOS process
- heterogeneous process
- high-voltage process
- HMOS process
- imaging process
- implantation process
- in-house process
- interconnection process
- inverted meniscus process
- ion plating process
- isoplanar -S, -Z, -2 process
- isoplanar process
- junction-isolated process
- laser-recrystallized process
- lithographic process
- low-pressure process
- low VT process
- lost wafer process
- major process
- masking process
- master slice process
- mesa-isolation process
- metal-gate MOS process
- metal-gate process
- microbipolar LSI process
- micrometer-dimension process
- mid-film process
- Minimod process
- Mo-gate MOS process
- Mo-gate process
- nitride process
- nitrideless process
- NSA process
- oxide-film isolation process
- oxide isolated process
- oxygen refilling process
- patterning process
- phosphorous buried-emitter process
- photoablative process
- photolithography process
- photoresist process
- planar oxidation process
- Planox process
- plasma etch process
- Poly I process
- Poly II process
- Poly 5 process
- poly-oxide process
- Poly-Si process
- polysilicon-gate process
- poly-squared MOS process
- proprietary process
- PSA bipolar process
- PSA process
- refractory metal MOS process
- refractory metal process
- sacrificial охide process
- sapphire dielectric isolation process
- scaled Poly 5 process
- screen-and-fire process
- selective field-охidation process
- self-aligned gate process
- self-aligned process
- self-registered gate process
- self-registered process
- semi-additive process
- semiconductor-thermoplastic-dielectric process
- semicustom process
- shadow masking process
- silk-screen process
- single poly process
- SMOS process
- SOS/CMOS process
- stacked fuse bipolar process
- Stalicide process
- step-and-repeat process
- subtractive-fabrication process
- surface process
- Telemos process
- thermal process
- thermally асtivated surface process
- thermal-охidation process
- three-mask process
- triple-diffused process
- triply-poly process
- twin-tub process
- twin-well process
- V-groove MOS process
- V-groove process
- wet process
- 3-D process -
17 tool
1) інструмент; пристосування; оснащення (напр. фотошаблону) 2) устаткування; верстат 3) піддавати механічній обробці 4) pl (інструментальні) засоби - antistatic tool
- artwork checking tool
- bonding tool
- CAD tools
- CAE/CAD tools
- computer-aided tool
- computer-aided engeneering tools
- computer-based design tools
- design synthesis tools
- desoldering tool
- diamond scribe tool
- DIP/IC insertion tool
- extraction tool
- hand tool
- insertion tool
- lead-forming tool
- lithography tool
- mask inspection tool
- physical layout tools
- pick-up tool
- placement tool
- process characterization tool
- scribing tool
- software tools
- soldering tool
- sputtering tool
- step-and-repeat tool
- wafer-reading tool
- wire-wrapping tool
- work tool
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nach dem Step-and-Repeat-Verfahren hergestellte Maske — fotokartotuvu pagaminta kaukė statusas T sritis radioelektronika atitikmenys: angl. step and repeat mask vok. nach dem Step and Repeat Verfahren hergestellte Maske, f rus. шаблон, изготовленный фотоповторителем, m pranc. masque d exposition créé… … Radioelektronikos terminų žodynas
